Classification of detector components and key points of selection :

According to the output mode:  Photo diode, Photo transistor, Darlington, Schmitt, LTV, LTF, etc

By packaging method:  COB (0603 1206), COB (base plate), general Φ 3mm、 Φ 5mm package, TO Can package, Ceramic stem package, die package, etc

By sensitive wavelength: UV device, visible light device, infrared receiving device

    ......

The sensitivity, sensitivity range, light receiving angle and other detailed parameters can also be controlled according to the type and size of Chip, packaging Resin characteristics/filters, lenses, etc

Generally, there are corresponding launch side products for use with it.

LTV、LTF、Dual Chip、Digital output、Darlinton ... etc.

Features :

SMD patch, small in size;

Simple packaging and low cost;

Different light-emitting chips can be packaged, and the presence and shape of Lens can be selected;

It is suitable for use scenarios such as signal on/off detection and target presence/absence detection.

Features :

DIP type；

Simple packaging and low cost;

Different light emitting chips and different light emitting angles can be packaged;

It is suitable for use scenarios such as signal on/off detection and target presence/absence detection.

Features:

SMD type；

Large area PD can be packaged;

According to the application needs, you can choose different packaging materials or install filters to control the sensitivity range;

Suitable for small signal detection or instrument field

Features :

DIP or SMD；

Rich case options (diameter, light receiving angle), suitable for a variety of applications;  

Have accurate angle control ability;

High reliability and long service life;

Suitable for high reliability occasions such as instruments and meters, financial machines and tools, automobiles and medical treatment;

Features :

Ceramic stem socket packaging, which can package light receiving chips of various sizes;

It has good electrical isolation characteristics and high reliability;  

Different packaging materials can be used, and filters can be flexibly added;

Suitable for high reliability occasions such as instruments and meters, financial machines and tools, automobiles and medical treatment;

Features :

DIP direct insertion, side view;

Apply a certain pressure in the precision mold to complete the encapsulation, with good optical accuracy;

Small size, with straight pin or bent pin, convenient for assembly or packaging into photoelectric switch;

Accurate optical path and high reliability;