Our company has independently developed a wide range of receiver side chips according to market application needs
Chips are divided into low dark current/high signal-to-noise ratio series, high response speed series, and special shaped customization Wait
Chips of the same size and specifications have different output modes such as PD (photodiode), PTr (phototransistor), APD (avalanche diode), etc
Adopting different packaging methods such as TO Can, ceramic tube holder, and molding.

Our company has developed flexible and diverse packaging solutions based on application requirements, And have a complete set of equipment and production testing capabilities related to packaging processes.
From DIP, SMD/COB, Transfer and other packaging,
Special methods such as TO Can packaging, QFN packaging, BGA packaging, etc
Can better utilize the photoelectric characteristics of the product and improve reliability and environmental tolerance.